Photovoltaics: Precision and throughput in productionHair-thin conductors, thin film layers and drill holes accurate to the micrometer: The success of solar power rests on tiny features. Lasers are the technological key to higher precision, high throughput and new designs.
The use of lasers in semiconductor fabricationThe separation of chips on a silicon wafer with mechanical saws is increasingly difficult with wafers becoming ever thinner. The microprocessing laser, on the other hand, separates chips in a contact-free manner and with no material loss at the edges of the cut. You can see the cutting of a silicon wafer. The high edge quality yields a higher resistance to breakage. This significantly reduces production rejects, saving production costs.
The latest trends in packaging try to accommodate Moore's Law by going in the z direction.
This expansion means stacking two or more dies to reach higher performance per chip area. One way to connect two or more dies is by making short, direct connections through the silicon substrate of each die. For this purpose, blind holes, reffered to as "Through Silicon Vias" (TSVs), are drilled into the silicon. The use of the laser allows the production of TSVs with no heat-affected zone. For these lasers, only a combination of sufficiently high pulse energy combined with a high pulse repetition rate on the order of 200 to 500 Kilohertz results in high throughput.
Lasers. Innovative and cost-effective production of electronics.Lasers mark electronic boards, relays, ICs, motor circuit breakers, mobile phone keypads, silicon wafers and much, much more – around the clock. Your advantages: - Product labeling in a very small space, allowing product traceability
- Fast and custom marking of multiple parts in one pass
- Online integration of fabrication data from a higher-level production system
- No mechanical or thermal load during marking, gentle handling for sensitive electronics
|
Edge of a silicon wafer a thickness of 300 μm cut with a high average power picosecond laser. No chipping and heat affected zone can be detected.
Edge deletion of thin-film solar modules
Drilling in polycrystalline silicon for rear side contact. |
|
