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Wafer Handling Tooling

Features
  • Every unique valve design ensures reliable suction and release of handled substrate.
  • The polished inner valve parts minimize particle generation.
  • The flatness of wafer tip provides excellent adhesion to handled substrate.
  • Various selective parts for your various handling application.
  • Various parts are compatible with our own product and for other vendors.
  • Major parts are made of engineering plastic to provide best abrasion resistance and less particle generation.
  • Carbon Fiber parts to insure dimensional stability.
  • ESD protection materials are applied to major parts of the system.
Product
  • PEEK + CF Tip Series
  • Vespel Tip Series
  • Customized Tip
  • Tip with Angle
  • Vacuum Wand
  • Portable VHS
  • Vacuum Gauge
  • Tuble & Connector
  • Stand

Application Field
  • Semiconductor Silicon wafer transfer
  • III-V Compound Semiconductor GaAs / Sapphire wafer handling
  • PV Solar cell wafer handling